Sharif Journal of Mechanical Engineering

Sharif Journal of Mechanical Engineering

Enhanced Interfacial Fracture Prediction in Electronic Solder Joints Considering T-Stress under Mixed-Mode I/II Loading

Document Type : Article

Authors
Zahra Kahji 1
Mahdi Fakoor 2
Saeid Shakhesi 3
Saeid Sarkheil 4
1 Space Science and Technology Institute, Amirkabir University, Tehran, Iran.
2 College of Interdisciplinary Science and Technology, University of Tehran, Tehran, Iran.
3 Iranian Space Research Center, Tehran, Iran.
4 3Iranian Space Research Center, Tehran, Iran.
10.24200/j40.2026.68157.1757
Abstract
Interfacial cracking between solder joints and printed circuit boards (PCBs) can compromise the mechanical reliability of electronic assemblies subjected to severe vibration. This study develops an interfacial fracture criterion for predicting crack initiation under mixed-mode I/II loading. The formulation is based on the maximum strain energy release rate criterion and incorporates the T-stress as the non-singular term of the near-tip stress field. The PCB is modeled as an orthotropic material using the reinforced isotropic solid concept, while the solder is treated as isotropic. The resulting formulation accounts for the influence of material anisotropy and T-stress on mixed-mode interfacial fracture. The predicted fracture limit curves are compared with available experimental data for validation. The results show that inclusion of the T-stress improves agreement between the theoretical fracture limit curves and experimental observations, demonstrating its importance in predicting interfacial fracture under mixed-mode loading.
Keywords
Electronic board
interfacial fracture
T-stress term
strain energy release rate
Subjects
 
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