عنوان مقاله [English]
The numerical solution of cooling air in a horizontal electronic board containing five chips as heat sources is presented. Heat transfer in air is considered as mixed laminar and steady and 2D convection and, in the solid domain, is considered as combined conduction and radiation. Governing equations are discretised by the FV method, radiation heat transfer is modeled with the radiossity/ irradiation method and Hottel's crossed-string method is used to evaluate view factors. A comparison between obtained numerical results and existing numerical and experimental results is made and shows the good accuracy of the numerical code. The effect of Reynolds number, Grashof number, aspect ratio and the distance between heat sources and their location, on the hydrodynamic and heat transfer behavior of electronic equipment, is investigated. According to obtained results, the aspect ratio has a considerable effect on the maximum temperature in electronic equipment and, whenever there is a limitation to selecting materials in the thermal designing of electronic equipment, a proper geometrical arrangement can be very useful.