مجله ی مهندسی مکانیک شریف

مجله ی مهندسی مکانیک شریف

بهبود پیش بینی شکست سطحی در اتصالات لحیم بورد الکترونیک با در نظرگرفتن نقش ترم تنش T تحت بارگذاری مود ترکیبی I/II

نوع مقاله : مقاله پژوهشی

نویسندگان
زهرا خاجی 1
مهدی فکور 2
سعید شاخصی 3
سعید سرخیل 3
1 پژوهشکده‌ی علوم و فناوری هوافضا، دانشگاه صنعتی امیرکبیر، تهران، ایران
2 دانشکده‌ی هوافضا، دانشگاه تهران، تهران، ایران.
3 پژوهشگاه فضایی ایران، تهران، ایران.
10.24200/j40.2026.68157.1757
چکیده
در طراحی اجزاء سامانه‌های فضایی، جلوگیری از ترک‌خوردگی تحت ارتعاش‌های شدید تصادفی از پارامترهای کلیدی طراحی به‌شمار می‌رود. ترک‌ها معمولاً در سطح بین اتصال‌های لحیم و بورد الکترونیک ایجاد می‌شوند؛ لذا، توسعه‌ی ابزارهای ریاضی برای پیش‌بینی شکست اهمیت ویژه‌ای دارد. در پژوهش حاضر، معیاری جهت پیش‌بینی شکست سطحی بین بورد الکترونیک و لحیم تحت بارگذاری مود ترکیبی I/II ارائه شده است؛ که بر مبنای مفهوم بیشینه‌ی نرخ آزادسازی انرژی کرنشی و با درنظرگرفتن ترم تنش T تدوین شده است. بورد الکترونیک و اتصال‌های لحیم به‌ترتیب به‌عنوان مواد اورتوتروپیک و ایزوتروپیک مدل‌سازی شده‌اند، که ماده‌ی اورتوتروپیک از طریق مفهوم جامد ایزوتروپیک تقویت‌شده شبیه‌سازی می‌شود. نتایج نشان داده‌اند که ترم تنش T نقش مهمی در پیش‌بینی مسیر و رفتار رشد ترک در ناحیه‌ی اتصال دارد. به‌کارگیری دقیق‌تر ترم تنش T در تحلیل مود ترکیبی، پیش‌بینی شکست نهایی بورد را به‌طور محسوسی بهبود می‌یخشد. در پایان، دقت معیار پیشنهادی با مقایسه با داده‌های تجربی موجود اعتبارسنجی شده است.
کلیدواژه‌ها
بورد الکترونیکی
شکست سطحی
ترم تنش T
بیشینه‌ی نرخ آزادسازی انرژی کرنشی.
موضوعات

عنوان مقاله English

Enhanced Interfacial Fracture Prediction in Electronic Solder Joints Considering T-Stress under Mixed-Mode I/II Loading

نویسندگان English

Zahra Kahji 1
Mahdi Fakoor 2
Saeid Shakhesi 3
Saeid Sarkheil 3
1 Space Science and Technology Institute, Amirkabir University, Tehran, Iran.
2 College of Interdisciplinary Science and Technology, University of Tehran, Tehran, Iran.
3 Iranian Space Research Center, Tehran, Iran.
چکیده English

Interfacial cracking between solder joints and printed circuit boards (PCBs) can compromise the mechanical reliability of electronic assemblies subjected to severe vibration. This study develops an interfacial fracture criterion for predicting crack initiation under mixed-mode I/II loading. The formulation is based on the maximum strain energy release rate criterion and incorporates the T-stress as the non-singular term of the near-tip stress field. The PCB is modeled as an orthotropic material using the reinforced isotropic solid concept, while the solder is treated as isotropic. The resulting formulation accounts for the influence of material anisotropy and T-stress on mixed-mode interfacial fracture. The predicted fracture limit curves are compared with available experimental data for validation. The results show that inclusion of the T-stress improves agreement between the theoretical fracture limit curves and experimental observations, demonstrating its importance in predicting interfacial fracture under mixed-mode loading.

کلیدواژه‌ها English

Electronic board
interfacial fracture
T-stress term
strain energy release rate
 
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